Description
MAG B550 TOMAHAWK


Core Boost TechnologyAn optimized power circuit layout is ready to unleash maximum performance.

6 layer PCB6 layer PCB improves signal transmission for high performance capabilities across the motherboard.

2oz Thickened Copper PCBAn enhanced PCB material design with 2oz thickened copper increases conductivity, improving heat dissipation and high-performance reliability.

Digital PWMA selection of the highest quality power delivery components lets the system run reliably even under extreme conditions.

PCIe Steel ArmorReinforced and shielded PCIe slots for strength and stability.
MAG B550 TOMAHAWK


Extended HeatsinkLarger heatsink design for cooling and performance.

M.2 Shield FrozrSustain maximum high-speed M.2 SSD data transfer with M.2 SHIELD FROZR and prevent SSD thermal throttling.

Pump Fan SupportControl watercooling pump speeds for flowrate and noise control.

Heatsinks with 7W/mK Thermal Pad7W/mK thermal pad provides better heat transfer to the heatsink.
MAG B550 TOMAHAWK


2.5G plus Gigabit LANOnboard 2.5G & Gigabit Ethernet LAN with gaming LAN manager.

Turbo USBFeaturing TURBO USB 3.2 GEN2 10Gbps with reversible Type-C connector.

DDR4 BoostThe memory circuit design has been optimized on a reserved section of the motherboard fully isolated from other circuits.

Lightning Gen 4 SolutionTransfer data lightning fast across Gen 4 PCI-E and M.2 with up to 64GB/s bandwidth.

An extended PWM heatsink and efficient circuit design keep temperatures in check and let the CPU power delivery system sustain extreme performance.

Sustain maximum M.2 SSD data transfer with M.2 SHIELD FROZR. Prevent SSD thermal throttling with a heatsink that extends across the motherboard.

Unleash and sustain maximum performance with an aggressive VRM design built to supply stable and steady power delivery.
- 10 phase Duet Rail CPU Power System / Smart Power Stage 60A
- 2 phase SOC Power
- 1 phase APU Power
- Digital PWM IC

An enhanced PCB material design with 2oz thickened copper increases conductivity, improving heat dissipation and high-performance reliability.
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