Description
Thermal Pad 12.8 W/mK, High-Temperature Resistance & Non-Conductive Heat Resistance
Key Features:
- Excellent thermal conductivity: Thermal pad can fill the gap between the heating element and the Heatsink with extremely high thermal conductivity (12.8 W/m.K) and reduce the heat source surface and the heat dissipation device contact surface between the contact thermal resistance. Thermal conductivity of silicone Pad can also be good filling the gap.
- Super reliable safe application: Non-toxic, odorless, anti-corrosion, wear resistant, anti-static, fire retardant, compression, good insulation, contact with any electrical traces wouldn’t result in damage of any sort
- Unique properties: balance thermal resistance and viscosity, and improve thermal conductivity of contact surfaces
- Easy to install: easily cut with different sizes to align with practical real cooling scenario.
- Dimension of Thermal Pad is 120mm X 120mm
- Available thicknesses are 0.5mm, 1.0mm, 1.5mm, 2.0mm, 2.5mm and 3.0mm
Wide Application:
- Computer hosts ,CPU, GPU, USICS, RDRAMTM, CD-ROM, IGPT module, hard disk drive, notebook computer
- Electronic products, motherboard,Gaming equipment,motor,graphics cards, external pad and foot pad
- Electrical appliances, high-power LED lighting, automotive machinery,communication equipment
- Power equipment, automotive electronic modules (engine scrubber) power modules, high-power power supplies
- Any other electronic equipment that needs to be filled with heat dissipation
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Installation Instructions of Thermal Pad:
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EXTREME ODYSSEY II 85x45x3.0mm
Let the ODYSSEY THERMAL PAD series continue, we launch the latest version of ODYSSEY II THERMAL PAD, which has a higher breakthrough in performance than the previous generation, letting players continue to enjoy a high-efficiency cooling experience. This ODYSSEY II THERMAL PAD can withstand electricity up to 9.8 KV, the thermal conductivity is 14.8 W/mk, and it is safe to use with insulation and non-conductivity. This thermal conductive sheet is very versatile and can be tailored for easy use, such as notebook computers, graphics cards, DRAM memory modules, communication equipment, SSD solid-state drives, car control devices, and gaming equipment, etc.
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