Specially designed for overclocking

• Specially developed to meet the demanding needs of the overclocking community. It exhibits excellent heat transfer performance and can fully exploit the capabilities of a high-performance cooling system.

• In the nano-particulate structure, micronized aluminum and zinc oxide contained in the paste interpolate slight unevenness of the heat medium such as CPU and the heat sink, and realize excellent thermal conductivity.

• The thermal pate special compound that drying does not proceed even at high temperature of 80 ° C is performed, and it does not cure for a long time and maintains stable characteristics. Also, there is no concern about shorts due to non-conductivity.